PCB: Manufacturing

EXAMPLE MATERIALS USED FOR PCB PRODUCTION

Laminate: CC-5400

Manufacturer: CKC TAIWAN
ANSI grade FR-4
Laminate thickness 0.5 mm, 0.8 mm, 1.0 mm, 1.5 mm
copper 18 um (1/2 oz) or 35 um (1 oz)
operating temperature Tg > 130 C
soldering 260C/500F - 40 sec., 290C/554F - 20 sec.
Dielectric cinstant 1Mhz: 4.0 - 4.5, guaranteed < 5.0
Dissipation factor 1MHz: 0.02-0.03, guaranteed < 0.03
Volume resistivity: Ohm.cm > 5*10^14
UL 94V-0, UL746 CTI 100

Photo resist:

LAMINAR 5000, manufacturer: Morton Electronic Materials Inc.
Riston 200, manufacturer: Dupont Electronic Materials Inc.

Solder mask: SD2467DG

manufacturer: Lackwerke Peters GmbH
UL 94 V-0, UL file: E80315

DOUBLE SIDE DSS/DSQ PCB PANEL SPECIFICATIONS

Panel sizes:
DSS 160x100 mm (6.3 x 3.9"),
DSQ 320x200 mm (12.6 x 7.8")
Laminate type:
FR-4
Laminate thickness:
0.5 mm, 0.8 mm, 1.0 mm, 1.5 mm (standard)
Laminate base copper thickness:
18/18 um (1/2 oz), 35/35 um (1 oz) (standard)
Soldermask:
double side liquid photoimagable (LPI) green color
Component print:
single side white color ink
Minimum tracks and spaces:
0,203 mm (0,008")
Standard drill tools:
0,7 mm (0,028"), 0,9 mm (0,035"), 1.0 mm (0,039"), 1.1 mm (0,043"), 1.3 mm (0,051"), 1.5 mm (0,059"), 2.1 mm (0,083"), 3.3 mm (0,13")
Number of drill holes:
up to 500 for DSS, up to 2000 for DSQ
PCB finish:
immersion gold ENIG ROHS compliant
De-panelization:
cut-to-border only in rectangle shapes
Turnaround time:
3-5 WORKING DAYS

What you should make sure is: your board no overlaping drill holes; no copper tracks/pads spaced at less 8 mils (0.2 mm); not using drill holes under 0.6 mm and over 5.0 mm; your pads/vias are 0.4 mm bigger than your drill holes so there is 0.2 mm copper ring around your drill holes; Your soldermask openings are not above 20% of total panel area, our finish is GOLD if there is no soldermask, or there are big soldermask openings we have to charge you additionally, so to produce board without soldermask by our process is more expensive than to produce board with soldermask, do not forget to send your soldermask files; Make sure your panelization is possible i.e sending two boards with 100x80 mm and asking them both on 160x100 mm panel is not possible. Please read our FAQ on panelization. Generate your Gerbers yourself and to check them with gerberviewer, sometimes it's hard to notice some silly errors in your CAD like printing component names or values over your SMT pads, manufacturer do DRC check only on the copper layers, from PCB manufacturing point of view it's not error if you cover your pads with soldermask or if you print over your SMT pads, your boards will be produced exactly as you have designed them, but you will have hard time later to solder them, so the best professional approach is to generate your gerbers and check them before sending boards for production. DESIGN RULES Our minimum track width/space is 0.2 mm (8 mils). The (pad/via - drill hole) clearence must be minimum 0.4 mm (16 mils) i.e. the resulting annual copper ring around the drilled hole to be 0.2 mm (8 mils), example: if 0.9 mm drill hole size is used it MUST have pad/via diameter = min. 1.3 mm Our minimum drill size is 0.6 mm (24 mils). we can't manufacture boards with smaller drill hole size. Our maximum drill size is 5.0 mm (197 mils) we can't drill large than 5.0 mm drill hole on your board, if your board have > 5.0 mm drill it will be replaced with 5.0 mm drill Our standard drill tool rack is: 0.7 mm (0.028"), 0.9 mm (0.035"), 1.0 mm (0.039"), 1.1 mm (0.043"), 1.3 mm (0.051"), 1.5 mm (0.059"), 2.1 mm (0.083"), 3.3 mm (0.13"). If you are using non-standard drill sizes you will be charged additionally see our PRICE web page. We are using METRIC drill sizes with step of 0.1 mm and all drill sizes are to be rounded to the nearest metric drill size. For instance if you are using 27 mils, 28 mils and 29 mils drill sizes they all will be rounded to 0.7 mm. To convert from IMPERIAL to METRIC you should divide your IMPERIAL drill size to 39.37 i.e. 130 mils / 39.37 = 3.3 mm and vice versa 1.0 mm = 39.37 mils after rounding = 39 mils. If this rounding is not taken into consideration you can easily make DRC violations - for instance you can use 34 mils drill with 50 mils pad/via which should pass the annular ring copper check as the pad-drill is 16 mils, but 34 mils drill = 0.86 mm will be rounded to 0.9 mm and the 1.27 mm pad/via will fail on the DRC check. Our drill hole limit is 500 holes for SSS,DSS and 2000 holes for SSQ,DSQ panels. If you exceed the maximum hole limit you will be charged additionally see our PRICE web page. Each layer MUST have text inside or outside PCB area to prevent board production with mirrored layers. i.e. the text on bottom should be mirrored if you look on the board from top. Lines under 0,1 mm (5 mils) on component print layer may not be visible.