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PCB http://www.epanorama.net/links/basics.html#pcb,http://www.intel.com/education/highered/signal/elct762.html,http://www.mitsi.com/PCB/free%20viewers.html Track length routed layer number Via types connection type:diffrential or normal board's size heat dissipation requirements;heat sinks Equivalent components often have different packages. components attachment to the board:surface mount , holes, screws, washers mechanical parts: switches or variable resistors board mount: stresses, shock, strain, shear board power source connection appropriate widths for each of the signal traces based on the trace current placing component then traces Check the polarity f the components Identify and lay out the the critical parts first. At least one continuous ground plane layer. Match terminations. Avoid sharp corners. Nothing can stop instantly. Including electrons. Keep signal traces and component leads as short as possible. Inputs and outputs should be far apart, so that RF energy will not leak back from output to input. stages should line up, rather than snake around. Decouple the RF parts of the circuit from the DC parts of the circuit. Shield AF and IF components from RF components.
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